Mie 300mm production line

Our company took over inherited the Mie 300mm fab from Fujitsu Semiconductor Limited. The fab started operations in 2005.
From the beginning of operations, this fab has been mainly providing foundry services for the advanced logic LSIs, and has established manufacturing, information management, quality control, and customer support systems for the foundry business In accordance with ISO14001, we pursue “Green Fab”.
According to the ISO9000 series and automotive IATF16949 certifications, we have established quality assurance and control systems.. Additionally, we have been making our utmost efforts towards safety and quality improvements.

  Fab B1 Fab B2
Start of operations 2005 2007
Total floor area 38,000m² 80,000m²
Clean room area 17,000m² 22,000m²
Location Kuwana City, Mie Prefecture
Wafer size 300mm
Process technology 40nm、55nm、65nm、90nm
Production capacity About 35,000 wafers/month
International Certifications ISO9001、ISO14001、IATF16949
Major features We deal with the risk of large-scale disasters by having clean rooms with earthquake-proof construction, a liquefied natural gas satellite base, and LIC (Lithium-ion capacitor).

Disaster Management

SWIT® (Swirling Induction Type HVAC System) ®

SWIT HVAC System installed in cleanroomSWITクリーンルームの概念図

The cleanroom uses SWIT, or swirling induction type HVAC, which creates temperature strata inside the cleanroom, and works with rising air currents created by heat-generating equipment to carry airborne dust toward the ceiling. This makes it possible to maintain a steady temperature in the work areas at lower elevations in the room more efficiently, so that the volume of air being supplied can be lower than in conventional HVAC systems. Also, because this allows for air to be supplied at a higher temperature, the chilled-water temperature can also be higher, which contributes to energy savings. Compared to existing systems, the annual energy used is expected to be roughly 47% lower for transport power and roughly 32% lower for heat-source power (*1).

PRESS RELEASE “World’s First Semiconductor Wafer Fab to Use Swirling Induction Type HVAC”

Earthquake-proof construction

For our earthquake management, we are the first semiconductor fab in the world to adopt a hybrid seismic isolation structure. Three types of seismic isolation systems have been placed between the building and its foundation, which under normal conditions minimize the effect of fine vibrations, allowing us to achieve a stable supply for our customers.

Seismic Isolation System: “Laminated rubber supports”
A rubber bearing that absorbs vibrations and attenuates the swaying of the building.

Seismic Isolation System: “Solid sliding supports”
A Teflon-coated sliding face that slides horizontally and absorbs the building’s vibrations.

Seismic Isolation System: “Oil damper”
This restricts the range of lateral movement of the Solid sliding supports bearing.

LNG Base

In preparation for a stoppage of the supply of city gas in the event of a large scale disaster, we have installed a liquefied natural gas (LNG) satellite base. As a result, in the event of a stoppage of gas, we are able to supply LNG using the satellite base and tanker vehicles. We continue to further strengthen our fab infrastructure against such disasters.

Lithium-ion capacitor

As a countermeasure against instantaneous voltage drops or power failures, we have adopted LIC (Lithium-ion capacitor). This enables the continuous operation of a stable fab.

Lithium-ion capacitor
Lithium-ion capacitor (LIC)

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