The shuttle service is a prototype service using a Multi Project Wafer (MPW). By allowing several customers to share masks and wafers, chip prototyping can be completed at a reduced cost. USJC provides the shuttle service for 55㎚ and 40㎚. It is available for use by a variety of customers in Japan and abroad. We are prepared to respond flexibly to your requests. Please do not hesitate to inquire.
Standard Spec
| 55㎚ | 40㎚ | |
|---|---|---|
| User area |
4,070 ㎛ × 4,070 ㎛ | 3,960 ㎛ × 3,960 ㎛ |
| Metal Layers | 6Cu + 1Al and over | - |
| Form of delivery | Bare dies | |
| Delivery quantity | 60dies / wafer | |
We can also handle specifications that are other than those mentioned above. Please inquire for details.
Inquiries concerning specificationsOptional Service
Quick delivery service : We will shorten the delivery period for a fee.
Schedule
55㎚ Technology
| 2025 | ||||
|---|---|---|---|---|
| - | - | Sep. | ||
| Booking Closes | - | - | Aug-19 | |
| Tape-out date | - | - | mid-Sep. | |
40㎚ Technology
| 2025 | ||||
|---|---|---|---|---|
| - | - | - | ||
| Booking Closes | - | - | - | |
| Tape-out date | - | - | - | |
Schedules are subject to change. Please contact us.
Contact usWorking Flow
01Estimating
We will make estimates based on the chip size and number required.
02Contracting
We will conclude non-disclosure agreements (NDA) and other agreements.
03Data releasing
We will release PDK, library materials, documents, etc.
04Shuttle entry
Please apply shuttle.
05Chip designing
-
06Data releasing
We will ask you to send GDS data to us.
07Data checking
We will check design data.
08Manufacturing
We will provide progress reports.
09Delivery
We will send die and WAT data.