The Shuttle Service is a test production service that uses MPW (multi-project wafer).
Because multiple customers share mask and wafer resources, the service makes it possible to manufacture test chips at low cost.
USJC provides the shuttle service for 55 nm and 40 nm. It is available for use by a variety of customers in Japan and abroad.
We are prepared to respond flexibly to your requests. Please do not hesitate to inquire.
|User area||4,070mm × 4,070mm||3,960mm × 3,960mm|
|Metal Layers||6Cu + 1Al and over|
|Form of delivery||Bare dies|
|Delivery quantity||50dies / wafer|
- We can also handle specifications that are other than those mentioned above. Please inquire for details.
- Please feel free to contact us for inquiries regarding wafer bumping and assembly service.
- Quick delivery service We will shorten the delivery period for a fee.
|Tape-out date||Mid – Mar.||End – Jun.||End – Sep.||Mid – Dec.|
|Tape-out date||–||Mid – Apr.||Mid – Jul.||Mid – Oct.|
- Schedules are subject to change. Please contact us.
We will make estimates based on the chip size and number required.
We will conclude non-disclosure agreements (NDA) and other agreements.
3. Data releasing
We will release PDK, library materials, documents, etc.
4. Shuttle entry
Please apply shuttle.
|5. Chip designing|
6. Data releasing
We will ask you to send GDS data to us.
7. Data checking
We will check design data.
We will provide progress reports.
We will send die and WAT data.