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Shuttle Service

The Shuttle Service is a test production service that uses MPW (multi-project wafer). Because multiple customers share mask and wafer resources, the service makes it possible to manufacture test chips at low cost. USJC provides the shuttle service for 55 nm and 40 nm. It is available for use by a variety of customers in Japan and abroad. We are prepared to respond flexibly to your requests. Please do not hesitate to inquire.

chip

Standard Spec

  55nm 40nm
User area 4,070μm × 4,070μm 3,960μm × 3,960μm
Metal Layers 6Cu + 1Al and over
Form of delivery Bare dies
Delivery quantity 60dies / wafer
  • We can also handle specifications that are other than those mentioned above. Please inquire for details.
shuttle contact

Optional service

  • Quick delivery service We will shorten the delivery period for a fee.

Schedule

40nm Technology
  2022
Booking Closes
Tape-out date
55nm Technology
  2022
Feb. May Aug. Nov.
Booking Closes Jan-11 Apr-12 Jul-5 Oct-4
Tape-out date mid-Feb. mid-May early-Aug. early-Nov.
  • Schedules are subject to change. Please contact us.

Working flow

1. Estimating We will make estimates based on the chip size and number required.
2. Contracting We will conclude non-disclosure agreements (NDA) and other agreements.
3. Data releasing We will release PDK, library materials, documents, etc.
4. Shuttle entry Please apply shuttle.
5. Chip designing
6. Data releasing We will ask you to send GDS data to us.
7. Data checking We will check design data.
8. Manufacturing We will provide progress reports.
9. Delivery We will send die and WAT data.

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