The shuttle service is a prototype service using a Multi Project Wafer (MPW). By allowing several customers to share masks and wafers, chip prototyping can be completed at a reduced cost. USJC provides the shuttle service for 55㎚ and 40㎚. It is available for use by a variety of customers in Japan and abroad. We are prepared to respond flexibly to your requests. Please do not hesitate to inquire.

Shuttle Service

Standard Spec

  55㎚ 40㎚
User
area
4,070 ㎛ × 4,070 ㎛ 3,960 ㎛ × 3,960 ㎛
Metal Layers 6Cu + 1Al and over -
Form of delivery Bare dies
Delivery quantity 60dies / wafer

We can also handle specifications that are other than those mentioned above. Please inquire for details.

Inquiries concerning specifications

Optional Service

Quick delivery service : We will shorten the delivery period for a fee.

Schedule

55㎚ Technology

  2024
  Mar. - Sep.
Booking Closes Feb-27 - Aug-6
Tape-out date late-Mar. - big-Sep.

40㎚ Technology

  2024
  - - -
Booking Closes - - -
Tape-out date - - -

Schedules are subject to change. Please contact us.

Contact us

Working Flow

Estimating

01Estimating

We will make estimates based on the chip size and number required.

Contracting

02Contracting

We will conclude non-disclosure agreements (NDA) and other agreements.

Data releasing

03Data releasing

We will release PDK, library materials, documents, etc.

Shuttle entry

04Shuttle entry

Please apply shuttle.

Chip designing

05Chip designing

-

Data releasing

06Data releasing

We will ask you to send GDS data to us.

Data checking

07Data checking

We will check design data.

Manufacturing

08Manufacturing

We will provide progress reports.

Delivery

09Delivery

We will send die and WAT data.